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Advisory Chair |
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Ljiljana Trajkovic,
Simon Fraser University, Canada |
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Conference Chairs |
Zhigong Wang,
Southeast University, China
Ning Xu, Wuhan University of Technology, China |
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Conference Co-Chairs |
Yufeng Guo, Nanjing
University of Posts and Telecommunications, China
Letian Huang, University of Electronic Science and
Technology of China, China
Weilin Xu, Guilin University of Electronic
Technology, China |
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Program Chairs |
Zhikuang Cai,
Nanjing University of Posts and Telecommunications,
China
Junyong Deng, Xi'an University of Posts &
Telecommunications, China |
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Program Co-Chairs |
Feng Liang,
University of Electronic Science and Technology of
China, China
Tangyou Sun, Guilin University of Electronic
Technology, China
Jerry Chun-Wei Lin, Western Norway
University of Applied Sciences, Norway
Haipeng Zhang,
Shangrao Normal University, China |
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Students Program Chairs |
Mingjian Zhao, South
China University of Technology, China
Huimin Liu, Tianjin University of Technology, China
Wenshan Zhao, Beijing Jiaotong University, China
Xueming Wei, Guilin University of Electronic
Technology, China
Yasuo Watanabe, Institute of
Electronics, Information and Communication Engineers
(IEICE), Japan |
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Publicity Chairs |
Jeff Kilby, Auckland
University of Technology, New Zealand
Yue Hu, Hangzhou Dianzi University, China
Youming Sun, Guangxi University, China
Liying Chen, Tiangong University, China
Pinqun Jiang, Guangxi Normal University, China
Sarawuth Chaimool, Khon
Kaen University (KKU), Thailand
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Technical Committee Members |
Hai-peng ZHANG,
Hangzhou Dianzi University,China
Zhihong Huang, Chinese Academy of Sciences, China
Kwanho You, Sungkyunkwan University, Korea
Meiryani, Bina Nusantara University, Indonesia
Weilin Xu, Guilin University of Electronic
Technology, China
Junfeng Qu, Clayton State University, USA
Ramesh B, Visvesvaraya Technological University,
Belgaum, India
Phaklen Ehkan, University Malaysia Perlis, Malaysia
Konagala Pavani, Vaagdevi College Of Engineering,
India
Harith Ahmad, University of Malaya, Malaysia
Basavaraj M. Angadi, Basaveshwar Engineering
College, India
William Arrasmith, Florida Institute of Technology
(FIT), USA
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